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dc.contributor.authorIkram I.M
dc.contributor.authorRabinal M.K
dc.contributor.authorKalasad M.N
dc.contributor.authorMulimani B.G.
dc.date.accessioned2020-06-12T15:04:43Z-
dc.date.available2020-06-12T15:04:43Z-
dc.date.issued2009
dc.identifier.citationLangmuir , Vol. 25 , 5 , p. 3305 - 3309en_US
dc.identifier.uri10.1021/la8035488
dc.identifier.urihttp://gukir.inflibnet.ac.in:8080/jspui/handle/123456789/4740-
dc.description.abstractHere, we report a simple method of forming electrical contacts on soft surfaces of organic monolayers and organically capped nanoparticles. It is based on the lift of predefined contacts of silver paste on a water surface and their pickup and float on a soft surface by capillary force. Three different surfaces of silicon - hydrogen terminated, covalently bonded organic molecules, and a thin film of organically capped CdSe nanoparticles - were used to constitute electronic junctions by lift and float of individual contacts. Charge transport measurements clearly demonstrate that these j unctions are free from shorting and wrinkling of the top contact and damage of molecular films. Hence, the method is simple, effective, nondestructive, and economical to form electronic junctions on molecular surfaces. © Copyright 2009 American Chemical Society.en_US
dc.titleFormation of electronic junctions on molecularly modified surfaces by lift-and-float electrical contactsen_US
dc.typeArticle
Appears in Collections:1. Journal Articles

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